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Multi-DUT Mobile & IoT Test System

IQxstream-M™, multi-DUT manufacturing test solution capable of calibration and verification of 2G/3G/4G devices and IoT modules operating on NB-IoT, Wi-Fi, Bluetooth®, Zigbee.

Its ultra-compact design and flexible architecture makes it highly suitable for high volume manufacturing of smartphones, tablets and cellular IoT modules.

Simple Setup with Higher Production Throughput

  • Simplifies manufacturing test of complex smartphone technologies
  • Provides 32 RF ports for parallel testing with direct connections to the DUT antenna, reducing the complexity of the test setup by eliminating external components
  • Delivers industry-leading high manufacturing yield with its best-in-class VSA power accuracy

Ideally Suited for Mobile & IoT requirements

  • No external components required for test setup
  • Easy application setup expedites test solution deployment
  • Versatile test solution, with comprehensive coverage of all mobile device wireless cellular and connectivity technologies
  • Optimized for high-end and high-volume mobile device manufacturing
  • Maximizes up-time with Factory Efficiency features, which detect and diagnose potential fixture issues
  • Hardware options for single device, multi-device and MIMO testing allow for system configuration customization

Comprehensive LTE NB-IoT Chipset Support

  • IQxstream-M is designed into all of the leading IoT chipset company software tools, providing simple bring-up and deployment of LTE IoT devices

Cellular, IoT and Connectivity Technology Options

  • GSM / EDGE
  • CDMA / CDMA2000
  • LTE-Advanced
  • LTE IoT UE categories Cat 1, Cat 0 (Cat M1) and Cat NB1 (NB-IoT)
  • Wi-Fi, 802.11a/b/g/j/n/p
  • Wi-Fi, 802.11af/ah
  • Bluetooth®, Classic (1.x, 2.x, 3.0), Low Energy (4.0, 4.1, 4.2) and Bluetooth® 5
  • Zigbee, Z-Wave and Wi-SUN
  • DECT
  • LTE
  • LPWAN, Sigfox / LoRa
  • Navigation (carrier-to-noise): GPS, GLONASS, Compass

When & Where to Use the IQxstream-M for Testing?

  • In manufacturing environments
  • For products in the PCB-level manufacturing, RF modules or end-of-line manufacturing lifecycle stages
  • For mobile or IoT devices